SAN FRANCISCO — For more than 50 years, designers of computer chips mainly used one tactic to boost performance: They shrank electronic components to pack more power onto each piece of silicon. Then more than a decade ago, engineers at the chipmaker Advanced Micro Devices began toying with a radical idea.
U.s. Focuses On Invigorating ‘chiplets’ To Stay Cutting-edge In Tech
The New York Times News Service Syndicate, Denver Post
Sat, 05/20/2023 - 5:00am
Topics: san francisco for advanced micro devices apple amazon tesla ibm subramanian iyer ucla american president joe biden s fabs but america commerce secretary gina raimondo georgetown university february the commerce department integra technologies wichita kansas amkor technology arizona what richard otte promex industries santa clara california related articles chatfished pixel 7a colorado independent recalled gerber malaysia south korea china moore s law silicon gordon moore anirudh devgan cadence design systems synopsys yole group today ponte vecchio argonne national laboratory chicago in january mi300 lawrence livermore national laboratory sam naffziger amd the mercury research taiwan semiconductor manufacturing co eliyan in march defense production act canadian andreas olofsson defense department asic the new york times economy now amd intel packaging asia united states chips act biden but as ai chips technology packaging ceo u.s valley taiwan the chiplets companies factories billion package transistors funding essential performance circuit products smaller electrical business major board computer concept idea components typically big industry company fields conventional based power years began signals makers start rapidly top suppliers program countries processor cheaper hundreds federal services connect advances service progress biggest plastic required cost wafer chiplet-style supercomputer workforce originally startup making developing domestic announced boards process electronic microprocessors plans million
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