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Bookmark or Share- Eliyan Delivers Industry’s Highest Performing Chiplet Interconnect PHY ...Eliyan Corporation is leading the chiplet revolution, focusing on a fundamental challenge with scaling semiconductor performance, size, power, and cost to meet the needs of high-performance computing applications.
- Technology - EliyanEliyan’s NuLink™ PHY technology can be optimized for high-speed serial die-to-die connections using any industry standard or custom interconnect scheme. It can deliver outstanding performance at low power in advanced packaging or standard packaging using a wide range of bump pitches.
- About - EliyanIn 2016, Eliyan Founder and CEO Ramin Farjadrad developed a breakthrough die-to-die interconnect architecture that reached new levels of high bandwidth and low latency at best-in-class area and power efficiency.
- The Ultimate Chiplet Interconnect. - Eliyan - HomeEliyan Ports Industry’s Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Products - EliyanEliyan has NuLink PHY IP products for industry standards (including UCIe and BoW) as well as unique value-added products including UMI™ and SBD. The NuLink PHY IP cores typically have 64 data lanes with configuration and bump map layout dependent on the PHY type (UCIe, BoW, UMI, SBD).
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