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- News – Okamoto CorporationOkamoto announced today that SEMATECH, the global consortium of chip-makers, has selected Okamoto’s GDM300 Backgrinder for processing Through Silicon Via (TSV). The System, a High-Precision wafer thinning tool, will be installed in SEMATECH’s 3D
- PRG-DX – Specifications – Okamoto CorporationPRG-DX grinders are highly productive by design. The wheelhead only needs to travel half of the rotary table diameter for full contact grinding.
- DCG Series – Specifications – Okamoto CorporationDCG Series grinders deliver the grinding versatility and capacity to precisely grind extremely large components. Dual grinding wheels provide for a wide range of grinding applications to minimize large work set-up.
- History – Okamoto CorporationOkamoto’s commitment to you, our valued customer spans over half a century. Our obligation is to provide you with the most advanced grinding technology and machinery possible, with a consistent, uncompromising dedication to quality.
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