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Bookmark or Share- Dicing Process using Blades (Blade Dicing) | DISCO Technology Advancing ...Please contact DISCO CORPORATION. Please feel free to contact us through the inquiry form or via phone call.
- KABRA｜DISCO CorporationGuarantee policy for customer using DISCO Products This is an ingot slicing method where a separation layer (KABRA layer) is formed at a specified depth by continuously irradiating an ingot with a laser, producing wafers starting from the KABRA layer.
- DISCO CORPORATE REPORT 2020DISCO Values clearly states: “By achieving excellence in all of our corporate activities, our existence will be welcomed by our stakeholders and society.” This indicates that DISCO is a corporation which aspires for technology and services regarded as an international standard. As such,
- DISCO HI-TEC AMERICA location and targets - dicing-grinding serviceDISCO is the world leader in cutting, grinding, and polishing technology. DISCO Hi-Tec America is responsible for supporting customers in North and South America. DISCO has amassed a vast knowledge base in precision processing a wide variety of materials.
- DISCO precision machines - dicing-grinding serviceManufactured at the Kuwabata Plant in Hiroshima Prefecture, DISCO’s precision dicing saws and grinding machines, combined with AOI tools, offer customers the highest level of quality. Consumables like tapes, dicing blades and grinding wheels complete our full service.
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